A five-axis machining centre cutting a precision part on a rotary trunnion.

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Material family — silicon

Mono-cast silicon parts, and the wafer work behind them.

We have grown our own silicon since 2008 and pioneered casted mono ingot for semiconductor parts in 2010. That vertical integration is why a focus ring and a 450 mm wafer service can come from the same building — and why the turn is short.

Parts

From ingot to finished chamber part.

Mono-cast and multi-cast silicon, grown in house and machined into the consumables that sit closest to the plasma. Silicon parts are a wear item by design — they are meant to erode instead of the chamber — so consistency between deliveries matters more than almost any other specification.

That is the argument for Copy Exact™. When a ring is qualified into a recipe, the next hundred need to behave identically, and that comes from holding the material route and the machining process fixed, not just the dimensions.

How we hold it

Focus & edge rings
Single-wafer etch and deposition chambers; the highest-turn silicon consumable.
Silicon electrodes
RF and plasma-facing electrode hardware machined from cast material.
Mono-cast ingot
Bi-directional and casted mono ingot, grown in house since 2008.
Multi & mono silicon wares
General fabricated silicon parts to customer drawing.

Wafer services

25 mm to 450 mm, on a one-day turn.

Substrates from Shin-Etsu, SUMCO and GlobalWafers — prime, test and mechanical grade, plus thin- and thick-film SOI. We reshape, process and clean silicon, sapphire and quartz wafers to whatever your experiment or your tool needs.

Wafer products and processing
Item Detail
Diameter range 25 mm – 450 mm
Grades Prime, test, mechanical
Substrate sources Shin-Etsu (SEH), SUMCO, GlobalWafers
SOI Thin-film and thick-film silicon-on-insulator
MEMS R&D wafers Thin and thick oxide bonded wafers, ±5%
Materials processed Silicon, sapphire, quartz
Turn time 1 day on wafer services

Processing operations

  • Laser cutting
  • Edge beveling
  • Edge grinding and polishing
  • Notch grinding
  • Lapping
  • Etching
  • Polishing
  • Bonding
  • Grinding
  • Cleaning

Custom reshaping. Our technical staff work directly with your engineers on non-standard geometries — partial wafers, unusual flats and notches, bonded stacks. If it is not a catalogue item, it is probably still a one-day job.

Engineering support

Two ways to start: with a drawing, or without one.

You have the drawing

We manufacture to existing engineering drawings, hold the tolerances stated on them, and return first-article measurement records against every dimension you have called out.

Upload a drawing →

You are still designing

We support at the design and R&D stage — material route, achievable geometry, what will and will not survive the process — so the silicon part meets the technical requirement before the drawing is frozen.

Talk to engineering →

Next step

Quote a silicon part or wafer job.

Send the drawing, the part number, or the wafer spec and quantity.