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By process area
Start from the process, not the material.
Nobody goes looking for “advanced ceramics.” They go looking for the part that failed in their diffusion furnace on Tuesday. This page is organised the way the problem arrives.
At a glance
Which material families we supply into each area.
Teal is quartz, steel is silicon, amber is ceramic. Most process areas take more than one, and cleaning and refurbishment applies across all of them.
| Process area | Quartz | Silicon | Ceramic | Refurb |
|---|---|---|---|---|
| Diffusion & thermal | Tubes, liners, boats, injectors, pedestals | — | Insulators, supports | Clean & requalify |
| Etch & single-wafer plasma | Rings, windows, liners | Focus rings, edge rings, electrodes | Nozzles, insulators, wear parts | Clean, resurface, ESC repair |
| Thin film & deposition | Injectors, liners, covers | Chamber hardware | SiC and alumina components | Clean & resurface |
| Wet clean & transport | Tanks, cleaning basins, carriers | — | Chemically inert hardware | Clean & passivate |
| Test & packaging | Windows | Wafer services | Test and handling hardware | Socket regeneration |
Diffusion & thermal
Vertical and horizontal furnace subcomponents are the oldest part of our quartzware business. Process tubes, liners, wafer boats, pedestals and gas injection hardware, in the grade the contamination budget calls for — 244 low aluminium where the thermal budget is unforgiving, low-alkali 214 or 224 where alkali migration is the constraint.
Thermal parts also refurbish well. Devitrification and process build-up are usually addressable long before the part is scrap.
Etch & single-wafer plasma
The highest-consumption area in most fabs and the one where consistency matters most. Silicon focus and edge rings are designed to erode instead of the chamber, which means the material route has to stay fixed between deliveries or the recipe moves with it. We cast our own mono silicon partly for that reason.
Around them sit quartz rings, windows and liners, ceramic nozzles and wear parts, and the electrostatic chuck — the single most valuable item in the chamber and one we repair rather than replace.
Thin film & deposition
Gas injection hardware, liners and covers where film builds on every surface that is not the wafer. The economics here favour refurbishment strongly: deposition parts come out coated rather than worn, and a clean returns them to service.
Silicon carbide and alumina components handle the positions where the combination of temperature, chemistry and plasma exposure rules quartz out.
Wet clean & wafer transport
Fabricated and welded quartz tanks, cleaning basins and carriers for wet benches and chemical baths, plus the handling hardware that moves wafers between them. Fused quartz is here for the same reason it is everywhere else in the fab — it survives the chemistry without contributing to it.
For stainless components in the same systems, ASTM A380 passivation is part of the service.
Test & packaging
Integrated circuit test hardware needs dimensional stability and electrical isolation held across very large cycle counts, which is a ceramic problem. It also needs cleaning — chipset socket regeneration recovers contact performance on hardware that is otherwise sound.
The wafer services line supports this area too, particularly for bonded stacks and reshaped substrates used in packaging development.
Not seeing your process?
The list above is where our fixturing and our people already have depth. It is not the limit of what we can machine. Almost everything we ship is made to a customer drawing, and the fastest way to find out whether a part is in scope is to send it to us.
Next step
Tell us the tool and the process.
That is usually enough for us to identify the part and quote it.